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半导体设备

CMP Chemical Mechanical Polishing

利用化学反应(Chemical)和机械处理(Mechanical)将Wafer研磨(Polishing)平整的半导体工艺。

CMP设备

CMP 장비

Application

· W, Cu, OXIDE

Specification

· High Throughput for Process
· Dual Polishing & Cleaner
· Carrier moving on (Chuttle) track system
· 4FOUP, 1 Metrology

Feature

· Easy Maintenance & Operation
· Left & Right Independent Operation
· Small Footprint

Equipment Sales Team : equipsales@kctech.co.kr