利用化学反应(Chemical)和机械处理(Mechanical)将Wafer研磨(Polishing)平整的半导体工艺。

Application
· W, Cu, OXIDE
Specification
· High Throughput for Process
· Dual Polishing & Cleaner
· Carrier moving on (Chuttle) track system
· 4FOUP, 1 Metrology
Feature
· Easy Maintenance & Operation
· Left & Right Independent Operation
· Small Footprint
Equipment Sales Team : equipsales@kctech.co.kr